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2024 Songshan Lake China IC Innovation Summit | ESWIN Computing’s RISC-V AI SoCs unlock application scenarios with greater computing power
2024-07-01

The 14th Songshan Lake China IC Innovation Summit was held in Dongguan on May 17, with the theme of “Innovative IC Products for Smart Robots.” The event unveiled 10 new IC products at the forefront of IC design in China and geared to the needs of smart robotics, with a view to promoting the development of homegrown chips for smart robotics and further strengthening the robot industry chain.

Lu Haibo, General Manager of Intelligent Computing at ESWIN Computing, delivered a speech tilted “EIC77 Series: AI SoCs Using 64-bit Out-of-Order RISC-V CPU and Self-developed High-performance NPU,” in which he shared the innovation outcomes and experience of ESWIN Computing in the field of RISC-V intelligent computing. At the event, ESWIN Computing showed a variety of RISC-V edge computing SoCs and AI PC chips, development boards, and their demos.


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Lu Haibo, General Manager of Intelligent Computing at ESWIN Computing, gives a speech

 

EIC77 series finds wider application with increased computing power

RISC-V is marked by open source, customization, high flexibility, and high scalability, and is finding wider application in the AI space. Based on its solid expertise in RISC-V intelligent computing, ESWIN Computing launched the EIC77 AI SoC series, which encompasses the single-die RISC-V edge computing SoC EIC7700 and the higher computing power edition EIC7700X, as well as the dual-die RISC-V AI PC SoC EIC7702 and the higher computing power edition EIC7702X. These offerings are intended to meet the different computing power requirements of various application scenarios.

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The EIC7700 edge computing SoC by ESWIN Computing

 

The EIC77 series adopts a 64-bit out-of-order RISC-V CPU and the company’s self-developed high-performance NPU, supports full-stack floating-point arithmetic calculations and large language models, and features a high-performance 3D GPU, with computing power of up to 39.9 TOPs. This series offers robust codec capabilities. A single chip supports up to 8K video decoding at 50 frames or 32-channel 1080p at 30 frames, and up to 8K video encoding at 25 frames or 13-channel 1080p at 30 frames. The dual chips support up to 8K video decoding at 100 frames or 64-channel 1080p at 30 frames, and up to 8K video encoding at 50 frames or 26-channel 1080p at 30 frames. The bandwidth is up to 112GB and the capacity up to 64GB, and a rich set of diverse external interfaces are available, such as USB, PCIe, HDMI, and Ethernet.

Plus, multiple EIC77 SoCs can achieve greater computing power through PCIe cascading, which can be applied to various fields with higher requirements for computing power, such as industrial vision in the AI era (such as industrial quality inspection, robotic arm positioning and guidance, and predictive maintenance), smart edge stations, cloud AI accelerators, and AI PCs to boost productivity in modern business, life, learning, and entertainment scenarios.

Lu Haibo stressed that the EIC7702X for AI PCs is configured with an 8-core 64-bit out-of-order RISC-V high-performance CPU and 2 3D GPUs, supports 2 HDMI interfaces, and delivers 4K dual-channel UHD display effects, which greatly improves the human-computer interaction experience and efficiency on desktop computers. On top of that, ESWIN Computing AI PC SoCs boast robust online video codec capabilities and up to 4Gbps low-latency Ethernet networking capabilities, offer computing power of up to 39.9 TOPS at INT8 precision, supports CNN models, OD models, and large language models (LLMs), and provide flexible solutions based on different AI workloads. This is conducive to local AI deployments and can effectively satisfy the requirements of AI PCs.

The EIC77 series overall delivers excellent performance. The EIC7700X single-die edition achieves a performance score of up to 2,900fps on MobileNetV2, over 600fps on ResNet50, and 9 tokens per second on the Llama2-7B model. The EIC7702X dual-die edition employs the coherent dual-die interconnect technology, which allows two single-die products to achieve completely independent memory access without affecting each other. The benchmark scores have doubled in testing, reaching 5,800fps on MobileNetV2 and above 1,200fps on ResNet50.

 

Multiform support helps customers achieve AI implementation

To help customers break new ground in more application scenarios of edge computing, the EIC77 series comes in three forms: IC, development board, and smart AI edge station. It provides high-performance, power-efficient AI solutions for security operations, smart manufacturing, smart education, and other application scenarios.

At the event, ESWIN Computing showcased the EIC7700 RISC-V edge computing IC and the HiFive Premier P550 RISC-V development board equipped with the IC. It also showed the PC demo, the 25-channel high-definition (1080p) video AI processing scenarios, and the applications of large language models. The company’s pavilion was teeming with professional visitors.

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At the pavilion of ESWIN Computing

 

Lu Haibo revealed that the EIC77 series has been mass-produced, winning a number of customers at home and abroad shortly after it was put on the market. Development boards for AI PCs will be launched soon to meet the needs of more customers.

In the age of AI, RISC-V has infinite potential. ESWIN Computing will, as always, be dedicated to research and development and continuously solidify its technical strengths and product competitiveness to provide best-in-class RISC-V AI SoCs for customers.