BEIJING, April 24, 2026 — The 19th Beijing International Automotive Exhibition (Auto China 2026) commenced today in Beijing under the official theme "Future of Intelligence." As a globally significant event for the automotive industry, this year's exhibition focuses on electrification, intelligentization, and digitalization, showcasing technologies and applications ranging from core hardware to software systems, as well as collaborative innovation achievements across the industrial chain. The event brings together global automakers and technology companies to discuss future mobility transformations and new directions for industrial upgrading.

As a RISC-V Oriented Chip Product Provider, ESWIN Computing presented its intelligent automotive chips and solutions at the exhibition. ESWIN Computing demonstrated a broad portfolio including automotive-grade control MCU, SerDes, CMS, HUD, touch interaction, and power management chips. Powered by self-developed RISC-V technology, ESWIN Computing delivers high-reliability, low-latency, and high-security chip solutions for smart cockpit and vehicle body control applications.

A major highlight of ESWIN Computing’s exhibition was the demo showcase of EAI8810, a dedicated chip designed exclusively for automotive HUD applications. Powered by ESWIN Computing’s self-developed RISC-V core, the EAI8810 integrates core functionalities on a single chip, including distortion correction, OSD and local dimming. Compliant with the ASIL-B functional safety standard, the chip optimizes in-vehicle display performance and system security, while substantially enhancing the cost-effectiveness of overall HUD solutions.

In terms of commercial deployment, ESWIN Computing has established partnerships with leading Tier 1 suppliers including Yanfeng, ADAYO, Atech Automotive, Jingwei Hirain, and Desay SV Automotive, which in turn serve OEMs such as SAIC Motor, BYD, Chery Automobile, and JAC Motors. Notably, the EAM2011 automotive-grade general-purpose MCU has entered mass production and is being shipped steadily, enabling in-vehicle applications such as wireless charging, smart seating, and battery management systems with high reliability and lightweight AI deployment capabilities. Meanwhile, ESWIN Computing's electronic CMS and SerDes chips and solutions are undergoing testing and validation with industry partners, with related projects advancing steadily. These solutions provide low-latency, high-stability chip support for scenarios including electronic side-view mirrors, streaming media rear-view mirrors, and in-vehicle multi-screen connectivity.

ESWIN Computing continues to drive technological innovation, fostering deep synergy between its self-developed RISC-V CPU IP and automotive-grade chips, and establishing an iterative technology roadmap of "Self-Developed IP R&D → Chip Development → Solution Delivery" ESWIN Computing's high-performance 32-bit RISC-V automotive-grade real-time CPU IP, R500A, has obtained ASIL‑B certification from TÜV Rheinland, and is integrated into the exhibited automotive CMS chip EAI8800. Its high-performance 32-bit RISC-V automotive-grade multi-core real-time CPU IP, R520A, has achieved ASIL‑D certification, the highest level of functional safety, from TÜV Rheinland, precisely addressing the stringent safety and real-time demands of next-generation zonal control units (ZCUs). This IP is already being used in the development of a body control ZCU chip. Looking ahead, ESWIN Computing's self-developed high-performance 64-bit RISC-V application-class CPU IP, S500, will be deployed in next-generation automotive chips.

ESWIN Computing will continue to refine the technology portfolio, deepen RISC-V innovation, and accelerate product iteration. By building a robust automotive-grade safety foundation with self-developed cores and establishing a comprehensive product matrix for in-vehicle scenarios, ESWIN Computing aims to collaborate with more automakers, Tier 1 suppliers, and ecosystem partners. Through reliable and cost-effective chip solutions, ESWIN Computing is committed to accelerating the deployment of intelligent automotive technologies and co-creating a new ecosystem for smart mobility.