At embedded world 2025 held in Germany in March, ESWIN Computing (Booth No.: 3A-521e, Nuremberg Exhibition Centre) debuted its groundbreaking development board with dual-die RISC-V general-purpose intelligent computing SoCs, along with its SoC series and other innovative products and solutions covering cloud, edge, and terminal applications. These products and solutions enable efficient AI processing to empower various fields such as security operations, industrial inspection, smart education, and embodied intelligence.

Groundbreaking development board with dual-die RISC-V intelligent computing SoCs

ESWIN Computing development board with dual-die RISC-V intelligent computing SoCs

The EIC7702X, ESWIN Computing’s RISC-V intelligent computing SoC designed for general-purpose AI tasks, integrates 8-core 64-bit out-of-order RISC-V CPUs, self-developed high-performance NPUs, and high-performance 3D GPUs, delivering a processing power up to 40 TOPS at INT8 precision. This product features a chiplet-based architecture and self-developed multi-die technology, and supports cache coherence and DeepSeek LLMs, with a high inference speed of 14 tokens per second. It boasts ultra-low latency in image/voice recognition, text generation, and other scenarios. The product also has superior audio and video codec capabilities, capable of high-definition and low-latency audio and video processing. Additionally, it supports a rich set of peripheral interfaces including USB, PCIe, HDMI, and Ethernet, enabling efficient processing of massive amounts of data and complex models.

The development board built upon dual-die EIC7702X SoCs was a magnet at embedded world 2025, pushing the boundaries of performance. It comes with 8-core RISC-V processors with a core frequency of up to 1.8GHz, 32GB/64GB LPDDR5 RAM, and 32GB eMMC; supports up to 102Gbps bandwidth and high-precision LLMs, and is compatible with various operating systems such as Debian, Ubuntu, Deepin, and openKylin. The flexible combination of System-on-Module (SOM) and baseboard allows for rapid deployment on PC, AI inference, embedded and edge systems, and other devices to build smart solutions.

Lightweight, widely applicable OSM with RISC-V edge computing SoCs

OSM with RISC-V edge computing SoCs

Catering to the needs for high cost-effectiveness and low power consumption, ESWIN Computing’s solderable Open Standard Module (OSM) compliant with the OSM 1.2 standard integrates 4-core RISC-V processors with a core frequency up to 1.8GHz. With an ultra-compact design (45mm × 45mm), it delivers a processing power of up to 19.95 TOPS, capable of running high-precision LLMs. It features 16GB LPDDR5 and 64GB eMMC to deliver extended runtime, and supports a rich set of peripheral interfaces, meeting the needs of smart video analysis, industrial PC, embedded and edge systems, smart factory, and other application scenarios.

Small, rugged single-board computer with RISC-V edge computing SoCs

SBC with RISC-V edge computing SoCs

Despite its small size (85mm x 56mm), ESWIN Computing’s Single Board Computer (SBC) with RISC-V edge computing SoCs (EIC7700X) features high performance and integrates strong capabilities such as wireless Communication, high-definition display interfaces, and multiple sensor connectivity. The SBC has 4-core RISC-V processors with a core frequency of up to 1.8GHz, supports HDMI 2.0, MIPI camera, SATA expansion, and features 16GB/32GB LPDDR5 and Wi-Fi and Bluetooth capabilities. It delivers an AI processing power of up to 19.95 TOPS, capable of running high-precision LLM; supports versatile connectivity options (HDMI, SATA, audio interfaces, MIPI, and camera interfaces), and is ready to use immediately. Therefore, it is ideal for a wide range of AI applications like smart education, development, as well as embedded and edge systems.

AI accelerator/video transcoding card for parallel video transcoding

AI accelerator/video transcoding card

In the fields of video cloud and security operations, ESWIN Computing’s AI accelerator/video transcoding card has five 8-core RISC-V processors, delivering peak performance of 200 TOPS. It supports up to 10 virtualization channels and real-time video transcoding and compression and features 5 × 32GB LPDDR5 RAM and 5 × 32GB SPI flash memory, meeting diverse needs such as AI video transcoding, AI inference acceleration, and scientific calculations.

Additionally, ESWIN Computing presented other products catering to a range of embedded needs from edge to cloud, such as the frontend IP camera smart update solution – Z530 AI Box, the smart factory solution – SOM with RISC-V edge computing SoCs, and the interactive whiteboard (IWB) smart analysis solution – industrial PC.

SOM with RISC-V edge computing SoCs

ESWIN Computing is pushing for deeper and wider presence of the RISC-V architecture. It is collaborating with industry partners with global influence to accelerate large-scale application of RISC-V products and solutions across the spectrum of industry, transportation, energy, education, and other fields.